The AMD Ryzen 9000 series builds on the power efficiency
Posted: Tue Feb 11, 2025 9:27 am
One of the key factors that determines the performance and efficiency of a processor is the manufacturing process, also known as lithography or node. This refers to the size of the processor's transistors, measured in nanometers nm. The smaller the transistors, the more of them can fit on a chip, resulting in higher performance and lower power consumption.
AMD has been ahead of Intel in this area for several years now, thanks to its partnership with TSMC, a leading semiconductor manufacturer. AMD’s latest Zen 4 processors the Ryzen 7000 and Ryzen 8000 series use 5-nanometer namibia telegram data and 4-nanometer manufacturing processes. This allows them to pack in more cores and cache, as well as features like 3D stacking technology X3D, which further improve performance.
The AMD Ryzen 9000 series continues this collaboration with TSMC by using 4nm lithography in its Zen 5 architecture. This manufacturing process allows AMD to fit more transistors on a chip, improving both performance and efficiency. that the Ryzen 7000 series is already known for, making it a leader in power consumption and thermal performance, especially in multi-core workloads.
On the other hand, Intel has been struggling with its manufacturing process, which has led to delays and failures in the production of its products. Therefore, Intel still uses the 10-nanometer process for its 13th and 14th-generation Core processors. However, the company has refined its processors, which use a hybrid architecture with two types of cores: high-performance and energy-efficient, like those found in smartphone processors. Thanks to this approach, many of Intel's latest processors can match or, in some cases, even surpass AMD models.
AMD has been ahead of Intel in this area for several years now, thanks to its partnership with TSMC, a leading semiconductor manufacturer. AMD’s latest Zen 4 processors the Ryzen 7000 and Ryzen 8000 series use 5-nanometer namibia telegram data and 4-nanometer manufacturing processes. This allows them to pack in more cores and cache, as well as features like 3D stacking technology X3D, which further improve performance.
The AMD Ryzen 9000 series continues this collaboration with TSMC by using 4nm lithography in its Zen 5 architecture. This manufacturing process allows AMD to fit more transistors on a chip, improving both performance and efficiency. that the Ryzen 7000 series is already known for, making it a leader in power consumption and thermal performance, especially in multi-core workloads.
On the other hand, Intel has been struggling with its manufacturing process, which has led to delays and failures in the production of its products. Therefore, Intel still uses the 10-nanometer process for its 13th and 14th-generation Core processors. However, the company has refined its processors, which use a hybrid architecture with two types of cores: high-performance and energy-efficient, like those found in smartphone processors. Thanks to this approach, many of Intel's latest processors can match or, in some cases, even surpass AMD models.